MICROSOFT
Hot chips aren’t just for lunch anymore
AI chips are producing far more heat than older designs, meaning that cooling is now one of the biggest obstacles to progress.
Current methods, like cold plates that sit on top of chips, are nearing their limits.
If demand continues to rise, these systems won’t be sufficient within the next few years.
To get ahead of this, Microsoft has developed a microfluidic cooling system that channels liquid coolant directly inside the silicon.
Tiny grooves are etched onto the chip, allowing liquid to flow exactly where heat is generated.
Tests have shown that it can remove heat up to three times more effectively than today’s cooling methods and lower chip temperatures by as much as 65%.
What makes it different is the use of AI to identify unique heat signatures on each chip.
This means the coolant is guided with precision, targeting the hottest spots rather than cooling the whole surface in the same way.
The result is not just cooler chips but the potential for denser, more efficient datacentres.
TL;DR
Microsoft’s microfluidic system cools chips 3x better than cold plates.
AI directs coolant to hotspots for maximum efficiency.
Could lead to faster, smaller, and more sustainable datacentres.
Nature-inspired, tech-approved
By keeping chips at safe temperatures, Microsoft could run servers harder without risking damage, support more powerful AI workloads, and even explore new designs like stacked 3D chips, something not possible with current cooling.
Beyond performance, the system could also cut costs and improve sustainability.
Cooler chips mean less energy spent on chilling datacentres and more efficient use of space, reducing pressure on power grids and making large-scale AI more sustainable.
Chips so hot, they need skincare routines.